Processes of making pad-less interconnect for electrical coreless substrate

ABSTRACT

A microelectronic device includes a laminated mounting substrate including a die side and a land side with a surface finish layer disposed in a recess on the mounting substrate die side. An electrically conductive first plug is in contact with the surface finish layer and an electrically conductive subsequent plug is disposed on the mounting substrate land side and it is electrically coupled to the electrically conductive first plug and disposed directly below the electrically conductive first plug.

RELATED APPLICATIONS

The present application is a divisional of U.S. patent application Ser.No. 12/215,018, filed on Jun. 24, 2008, entitled “PROCESSES OF MAKINGPAD-LESS INTERCONNECT FOR ELECTRICAL CORELESS SUBSTRATE”, which ishereby incorporated herein by reference in its entirety and for allpurposes.

TECHNICAL FIELD

Disclosed embodiments relate to semiconductive apparatus, packages, andprocesses of making them.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to understand the manner in which embodiments are obtained, amore particular description of various embodiments briefly describedabove will be rendered by reference to the appended drawings. Thesedrawings depict embodiments that are not necessarily drawn to scale andare not to be considered to be limiting in scope. Some embodiments willbe described and explained with additional specificity and detailthrough the use of the accompanying drawings in which:

FIG. 1 a is a cross-section elevation of a microelectronic devicemounting substrate during core formation processing according to anembodiment;

FIG. 1 b is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 a after further first dielectriclamination processing according to an embodiment;

FIG. 1 c is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 b after lamination layer drilledand external surface finish plated according to an embodiment;

FIG. 1 d is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 c after further via drilling andCu plating processing according to an embodiment;

FIG. 1 e is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 d after further lamination andmetal routing definition according to an embodiment;

FIG. 1 f is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 e after final build up process andexternal passivation layer processing according to an embodiment;

FIG. 1 g is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 f after lithography patternformation exposing metallic pads and covered by external surface finishfurther processing according to an embodiment;

FIG. 1 h is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 g indicating core cut forseparation processing according to an embodiment;

FIG. 1 j is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 h after further separation,indicating only one side of the build up according to an embodiment;

FIG. 1 k is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 j after solder interconnectprocessing according to an embodiment;

FIG. 2 is a perspective view of the microelectronic device mountingsubstrate depicted in FIG. 1 b after lamination layer drilled and readyfor external surface finish to be applied according to an embodiment;

FIG. 3 a is a detail section of the microelectronic device apparatusindicating package to die interconnect where both die and package arebumped depicted in FIG. 3 d during processing according to an exampleembodiment;

FIG. 3 b is a detail section of the microelectronic device apparatusindicating package to die interconnect where only package is bumpeddepicted in FIG. 3 d during processing according to an exampleembodiment;

FIG. 3 c is a detail section of the microelectronic device apparatusindicating package to die interconnect where only die is bumped depictedin FIG. 3 d during processing according to an example embodiment

FIG. 3 d is a cross section elevation of a microelectronic deviceapparatus indicating mother board, package and die whole set accordingto an example embodiment;

FIG. 4 is a process flow diagram according to an embodiment; and

FIG. 5 is a schematic of an electronic system according to anembodiment.

DETAILED DESCRIPTION

Reference will now be made to the drawings wherein like structures maybe provided with like suffix reference designations. In order to showthe structures of various embodiments most clearly, the drawingsincluded herein are diagrammatic representations of integrated circuitstructures. Thus, the actual appearance of the fabricated structures,for example in a photomicrograph, may appear different while stillincorporating the claimed structures of the illustrated embodiments.Moreover, the drawings show only the structures necessary to understandthe illustrated embodiments. Additional structures known in the art havenot been included to maintain the clarity of the drawings.

FIG. 1 a is a cross-section elevation of a microelectronic devicemounting substrate 100 during processing according to an embodiment. Twoseparate metallic foils, for example copper, are laminated on each sideof a central core 110 External metallic substrate layers 112, 152 arelonger than center metallic substrate layers 111 and 151. A mountingsubstrate foundation 1 is a compose laminate of four metallic substratelayers and the central core 110 In an embodiment, the metallicsubstrates are made of copper foil. The central core 110, the first sidemetallic substrate layers 112 and 111, and the second side metallicsubstrate layers 152 and 151 are part of a mounting substrate foundation1.

FIG. 1 b is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 a after further processingaccording to an embodiment. The mounting substrate 101 has beenprocessed to include a first dielectric layer 114. The first dielectriclayer 114 may be referred to as a first side first dielectric layer 114and the second side metallic substrate 152 also supports a second sidefirst dielectric layer 154. Accordingly, the structure depicted in FIG.1 b may be referred to as part of the mounting substrate foundation 1.

FIG. 2 is a perspective view of the microelectronic device mountingsubstrate depicted in FIG. 1 b after further processing according to anembodiment. The microelectronic device mounting substrate 200 includesthe central core 110 and the four copper layers of the metallicsubstrates 112 and 111, and 152 and 151, and the first dielectric layers114 and 154.

A recess 118 has been formed in the mounting substrate foundation 1 atthe first dielectric layer 114 (FIG. 1 b). The first dielectric layer114 is henceforth designated as the first dielectric layer 115 with therecess 118 having changed the structure thereof. In an embodiment, therecess 118 is formed by radiant energy ablation of the first dielectriclayer 115 such as a laser drilling process. In an embodiment, the recess118 has formed a characteristic recess dimension such as a diameter thatis later used as a final location for an electrical contact such as amicro ball or a micro solder bump in the 50 μm to 100 μm range. Spacingbetween recesses and recess diameter is controlled by the radiant energyablation, where only the tolerance of radiant energy ablation isaffecting the spacing and the recess diameter.

Three occurrences of the recess are depicted including the recess 118,the recess 120, and the recess 122. In an embodiment, themicroelectronic device mounting substrate 200 includes an edge 124. Therecess 118 is depicted being nearest the edge 124 such as a recess atthe perimeter of a mounting substrate. The recesses 120 and 122 may be“center” recesses meaning they are nearer to the center of a mountingsubstrate than a nearby perimeter recess such as the recess 118. In anembodiment, the perimeter recess 118 has a first diameter 126 and thecenter recess 120 has a second diameter 128 that is smaller than thefirst diameter 126. In an embodiment, the first diameter 126 and thesecond diameter 128 have substantially the same diameter.

In an embodiment, the first diameter 126 is in a range from about 50micrometer (μm) to about 100 μm. In an embodiment, the first diameter126 is 74 μm and the second diameter 128 is smaller than the firstdiameter. In an embodiment, the first diameter 126 is 74 μm and thesecond diameter 128 is also 74 μm.

In an embodiment the center recess 120 and the center recess 122 arespaced apart on a center-to-center pitch 130 in a range from about 100μm to about 180 μm. In an embodiment, the center-to-center pitch 130 isin a range from about 120 μm to about 150 μm. The pitch 130 isunderstood to be between a given recess and an adjacent recess. Thepitch 130 between the perimeter recess 118 and the center recess 120 maybe identical in each embodiment to the pitch 130 between the centerrecess 120 and the center recess 122. In an embodiment, the pitch 130 isabout 150 μm. In an embodiment, the first diameter 126 is 74 μm and thepitch 130 is 150 μm. In an embodiment, the first diameter 126 is 74 μm,the second diameter 128 is smaller than the first diameter 126, and thepitch 130 is 150 μm. In an embodiment, the first diameter 126 is 74 μm,the second diameter 128 is also 74 μm, and the pitch 130 is 150 μm.

Formation of the several recesses 118, 120, and 122 is useful for afirst and only registration for achieving an electrical connectorlanding space under design rules such as for a microball or a microsolder bump.

FIG. 1 c is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 b after further processingaccording to an embodiment. The mounting substrate 102 exhibitsprocessing on the second side as well as the first side. On the firstside, the recesses 118, 120 and 122 are shown. Similarly on the secondside, recesses 160, 162 and 164 have been formed in the second sidefirst dielectric layer 154 (FIG. 1 b) and has been structurally alteredby formation of the recesses 160, 162 and 164 to be referred tohereinafter as the second side first dielectric layer 115.

In an embodiment, the recess 118 has been processed by forming a surfacefinish first layer 132 upon the exposed first side metallic substrate112. Similarly, the recess 160 has been processed by forming a secondside surface finish first film 156 upon the exposed second side metallicsubstrate 152 according to an embodiment. In an embodiment, the surfacefinish first layer 132 is further processed by forming a surface finishsecond layer 134. In an embodiment, the surface finish first layer 132is a material such as a gold metal (Au) and the surface finish secondfilm 134 is a material such as a palladium-group alloy such as Au Pd Ni.The second side is processed similarly to form a surface finish firstlayer 156 of Au and the surface finish second layer 158 is a PdNiCualloy.

Formation of the surface finish layers is self-aligned such that underdesign rules no further registration alignment is needed to form therecesses and the surface finish layers. Conventionally, more than afirst and only registration alignment is needed. In an embodiment, thesurface finish layers are achieved by electroplating a selected metal oralloy onto the metallic substrates 112 and 152. In an embodiment, thesurface finish films are achieved by electrolytic plating where platinghas an affinity only to the metal of the metallic substrates 112 and 152and not to the dielectric layers 115 and 154.

Further processing may be understood to be carried out on the secondside as well as the first side, but hereinafter, processing will bedescribed only for the first side.

FIG. 1 d is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 c after further processingaccording to an embodiment. The mounting substrate 103 has beenphotolithographically processed and plated to form an electricallyconductive first plug 136 in contact with the surface finish second film134. In an embodiment, the electrically conductive first plug 136 is ametal. In an embodiment, the electrically conductive first plug 136 is acopper metal, the surface finish second layer 134 that contacts thefirst plug 136 is a palladium-group metal or alloy, and the surfacefinish first film 132 is gold. In an embodiment, the electricallyconductive first plug 136 is a metal such as copper, the surface finishsecond film 134 is an electrochemically more noble metal or alloy thanthe first plug 136, and the surface finish first layer 132 is a morenoble metal or alloy than the second film 134.

FIG. 1 e is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 d after further processingaccording to an embodiment. The mounting substrate 104 has beenprocessed to form several dielectric layers and conductive plugs. Asillustrated, the electrically conductive first plug 136 has been formedthrough a recess in the first dielectric layer 115. Similarly, anelectrically conductive second plug 140 has been formed through a recessin a second dielectric layer 130. Further, an electrically conductivesubsequent plug 144 has been formed through a recess in a thirddielectric layer 139. Further layers have been fabricated as illustratedon the second side. The electrically conductive subsequent plug 144 is athird plug as depicted in the illustrated embodiment. In an embodiment,the electrically conductive subsequent plug 144 may be a second plug, athird plug, or an N^(th) plug where N is a number adapted to a specificapplication. In an embodiment, the mounting substrate foundation 1 mayhave several layers such as where N is equal to a number between 2 and50. In an embodiment, N is between 4 and 10. In an embodiment, N isbetween 11 and 40. In an embodiment, the electrically conductivesubsequent plug may be landing on a metallic and re-routed to anotherplug to be electrically connected to the next layer.

FIG. 1 f is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 e after further processingaccording to an embodiment. The mounting substrate 105 has been overlaidwith a solder mask layer 146 in preparation to forming a solder-resistopen (SRO) to expose the electrically conductive subsequent plug 144.

FIG. 1 g is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 f after further processingaccording to an embodiment. The mounting substrate 106 has been etchedto form a land-side SRO 148 in the solder mask layer 147 (solder masklayer 146 in FIG. 1 f). Further processing includes the formation of aland-side bond pad 150 in the land-side SRO 148.

FIG. 1 h is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 g after further processingaccording to an embodiment. The mounting substrate 107 is in the processof being laterally cropped as indicated by the dashed cropping lines160. The process of laterally cropping allows for the first side and thesecond side to be separated from the central core 110 to be discarded.In an embodiment during fabrication of the mounting substrate foundation1, the first side and the second side act to counter warping and bowingforces that may be present without the first side countering the secondside.

FIG. 1 j is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 h after further processingaccording to an embodiment. After cropping (FIG. 1 h), the mountingsubstrate 108 exhibits the edge 124 as it appears is a finished mountingsubstrate. The mounting substrate foundation 2 is a cropped laminate andtherefore has a different structure from the mounting substratefoundation 1 depicted in the previous FIGS. The mounting substrate 108is also illustrated with an X-Z plane for further description.

FIG. 1 k is a cross-section elevation of the microelectronic devicemounting substrate depicted in FIG. 1 j after further processingaccording to an embodiment. The mounting substrate 109 has been invertedcompared to the presentation in FIG. 1 j. The second side is notillustrated as it is virtually identical to the first side after removalof the central core 110. The metallic substrate 112 is also removed toexpose the surface finish first film 132. In an embodiment, the metallicsubstrate 112 is copper and it is removed by a copper etchback processsuch as a chemical-mechanical polishing (CMP) technique.

In this configuration, the laminated mounting substrate 109 includes thesurface finish films 132 and 134 disposed in the first recess 118 andthe electrically conductive first plug 136 in direct contact with thesurface finish first layer 132. Further, the electrically conductivesubsequent plug 144 is disposed directly below the electricallyconductive first plug 136.

After removal of the metallic substrate 112, an electrical contact 182has been formed on the surface finish first layer 132. In an embodiment,the electrical contact 182 is a solder interconnect 182. In anembodiment, the electrical contact 182 is a micro solder bump 182 thathas been placed by use of a solder paste template. In any event thefirst and only registration of each of the recesses such as the recess118 has allowed for a self-aligned recess that accepts an electricalcontact 182 above a metal plug 136 that may have at least one surfacefinish 134 and/or 132 on a die side of the mounting substrate foundation2.

FIG. 3 a is a detail section of the microelectronic device apparatus 303depicted in FIG. 3 d during processing according to an exampleembodiment. The apparatus 300 is depicted as a mounting substratefoundation 3 being mated to a microelectronic die 366. The mountingsubstrate foundation 3 shows a portion of a structure including anelectrically conductive first plug 336, a dielectric first layer 315, asurface finish first film 332 and a surface finish second film, 334. Anelectrical contact 382 such as a microball 382 is also disposed on thesurface finish first film 332.

The exhibited portion of the microelectronic die 366 also has a die bump368 such as a solder paste for reflow. After mating the microelectronicdie 366 to the mounting substrate foundation 3, the achieved structuremay be see in FIG. 3 d.

FIG. 3 b is a detail section of the microelectronic device apparatus 303depicted in FIG. 3 d during processing according to an exampleembodiment. The apparatus 301 is depicted as a mounting substratefoundation 3 being mated to a microelectronic die 366. The mountingsubstrate foundation 3 shows a portion of a structure including anelectrically conductive first plug 336, a dielectric first layer 315, asurface finish first film 332 and a surface finish second film, 334. Anelectrical contact 382 such as a solder interconnect 382 is alsodisposed on the surface finish first layer 332.

The exhibited portion of the microelectronic die 366 also has a die bondpad 367 but no die bump is prepared in this embodiment. After mating themicroelectronic die 366 to the mounting substrate foundation 3, theachieved structure may be see in FIG. 3 d.

FIG. 3 c is a detail section of the microelectronic device apparatus 303depicted in FIG. 3 d during processing according to an exampleembodiment. The apparatus 302 is depicted as a mounting substratefoundation 3 being mated to a microelectronic die 366. The mountingsubstrate foundation 3 shows a portion of a structure including anelectrically conductive first plug 336, a dielectric first layer 315, asurface finish first film 332 and a surface finish second film, 334. Noelectrical contact is prepared on the surface finish first film 332before mating according to an embodiment.

The exhibited portion of the microelectronic die 366 also has a die bump368 such as a solder paste for reflow. After mating the microelectronicdie 366 to the mounting substrate foundation 3, the achieved structuremay be seen in FIG. 3 d.

FIG. 3 d is a cross section elevation of a microelectronic deviceapparatus 303 according to an example embodiment. The mounting substratefoundation 3 is flip-chip mated to a microelectronic die 366. Severalelectrical contacts electrically couple the microelectronic die 366 tothe mounting substrate foundation 3. Two electrical contacts aredelineated. A perimeter electrical contact 370 and a center electricalcontact 378 are depicted. The perimeter electrical contact 370 is nextto the edge 324 of the mounting substrate foundation 3. In anembodiment, the perimeter electrical contact 370 is larger than thecenter electrical contact 378. In an embodiment, the perimeterelectrical contact 370 is substantially the same size as the centerelectrical contact 378.

The pitch 330 between any to electrical contacts may be any pitchembodiment set forth in this disclosure. Further, a standoff 380 existsbetween the microelectronic die 366 and the mounting substratefoundation 3. In an embodiment, the standoff 380 is about 60 μm. In anembodiment, the standoff 380 is about 60 μm, the pitch 330 between anytwo electrical contacts is about 150 μm, and the electrical contacts areformed by mating a solder interconnect on the mounting substratefoundation 3 to a solder bump on the microelectronic die 366. In anembodiment, the standoff 380 is about 60 μm, the pitch 330 between anytwo electrical contacts is about 150 μm, and the electrical contacts areformed by mating a solder interconnect on the mounting substratefoundation 3 to a bond pad on the microelectronic die 366. In anembodiment, the standoff 380 is about 60 μm, the pitch 330 between anytwo electrical contacts is about 150 μm, and the electrical contacts areformed by mating a the mounting substrate foundation 3 to a solder bumpon the microelectronic die 366.

In an embodiment, the apparatus 303 includes a board 376 such as amotherboard. The mounting substrate foundation 3 is bumped to the board376 through a series of board bumps, one of which is designated withreference numeral 376. In an embodiment, a pitch 372 between two boardbumps 374 is about 400 μm and the board bumps 374 have a diameter ofabout 200 μm. It can now be seen the mounting substrate foundation 3 hasa die side and a land or board side. The perimeter electrical contact370 and the center electrical contact 372 are on the die side and theboard bump 374 is on the land side.

FIG. 4 is a process flow diagram 400 according to an embodiment.

At 410, the process includes forming a recess in a dielectric layer on ametallic substrate.

At 412, the process includes forming a surface finish on the metallicsubstrate. In an embodiment, forming the surface finish includes forminga first surface finish layer and a second surface finish layer.

At 420, the process includes forming a first electrically conductiveplug in the recess above the metallic substrate. In an embodiment,forming the first electrically conductive plug is done in direct contactto the metallic substrate. In an embodiment, forming the firstelectrically conductive plug is done in direct contact to a surfacefinish layer that is above the metallic substrate additional routing isadded for the layer according to the specific application (not shown).

At 430, the process includes forming a subsequent metallic plug abovethe first electrically conductive plug and its respective routing forthe layer according to the specific application (not shown).

At 432, the process includes forming a bond pad on the subsequent plug.

At 440, the process includes mating a micro ball or a micro solder bumpto the subsequent electrically conductive plug.

At 450, the process includes forming a flip-chip package between thelaminate that contains the subsequent electrically conductive plug and amicroelectronic die.

FIG. 5 is a schematic of an electronic system 500 according to anembodiment. The electronic system 500 as depicted can embody a mountingsubstrate or an apparatus with a tight-pitch laminate such as a pitch of150 μm between subsequent electrically conductive plugs that each fillinto a 74 μm diameter recess as set forth in this disclosure. In anembodiment, the electronic system 500 is a computer system that includesa system bus 520 to electrically couple the various components of theelectronic system 500. The system bus 520 is a single bus or anycombination of busses according to various embodiments. The electronicsystem 500 includes a voltage source 530 that provides power to theintegrated circuit 510. In some embodiments, the voltage source 530supplies current to the integrated circuit 510 through the system bus520.

The integrated circuit 510 is electrically coupled to the system bus 520and includes any circuit, or combination of circuits according to anembodiment. In an embodiment, the integrated circuit 510 includes aprocessor 512 that can be of any type. As used herein, the processor 512may mean any type of circuit such as, but not limited to, amicroprocessor, a microcontroller, a graphics processor, a digitalsignal processor, or another processor. Other types of circuits that canbe included in the integrated circuit 510 are a custom circuit or anASIC, such as a communications circuit 514 for use in wireless devicessuch as cellular telephones, pagers, portable computers, two-way radios,and similar electronic systems. In an embodiment, the processor 510includes on-die memory 516 such as SRAM. In an embodiment, the processor510 includes on-die memory 516 such as eDRAM.

In an embodiment, the electronic system 500 also includes an externalmemory 840 that in turn may include one or more memory elements suitableto the particular application, such as a main memory 542 in the form ofRAM, one or more hard drives 544, and/or one or more drives that handleremovable media 546, such as diskettes, compact disks (CDs), digitalvideo disks (DVDs), flash memory keys, and other removable media knownin the art.

In an embodiment, the electronic system 500 also includes a displaydevice 550, an audio output 560. In an embodiment, the electronic system500 includes a controller 570, such as a keyboard, mouse, trackball,game controller, microphone, voice-recognition device, or any otherdevice that inputs information into the electronic system 500.

As shown herein, the integrated circuit 510 can be implemented in anumber of different embodiments, including an electronic package with amounting substrate or an apparatus with a tight-pitch laminate such as apitch of 150 μm between subsequent electrically conductive plugs thateach fill into a 74 μm diameter recess, an electronic system, a computersystem, one or more methods of fabricating an integrated circuit, andone or more methods of fabricating an electronic assembly that includesa mounting substrate or an apparatus with a tight-pitch laminate such asa pitch of 150 μm between subsequent electrically conductive plugs thateach fill into a 74 μm diameter recess as set forth herein in thevarious embodiments and their art-recognized equivalents. The elements,materials, geometries, dimensions, and sequence of operations can all bevaried to suit particular packaging requirements.

The Abstract is provided to comply with 37 C.F.R. §1.72(b) requiring anabstract that will allow the reader to quickly ascertain the nature andgist of the technical disclosure. It is submitted with the understandingthat it will not be used to interpret or limit the scope or meaning ofthe claims.

In the foregoing Detailed Description, various features are groupedtogether in a single embodiment for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted asreflecting an intention that the claimed embodiments of the inventionrequire more features than are expressly recited in each claim. Rather,as the following claims reflect, inventive subject matter lies in lessthan all features of a single disclosed embodiment. Thus the followingclaims are hereby incorporated into the Detailed Description, with eachclaim standing on its own as a separate preferred embodiment.

It will be readily understood to those skilled in the art that variousother changes in the details, material, and arrangements of the partsand method stages which have been described and illustrated in order toexplain the nature of this invention may be made without departing fromthe principles and scope of the invention as expressed in the subjoinedclaims.

What is claimed is:
 1. An apparatus comprising: a laminated mountingsubstrate including a die side and a land side; a surface finish filmdisposed in a recess on the mounting substrate die side; an electricallyconductive first plug in contact with the surface finish film; anelectrically conductive subsequent plug disposed on the mountingsubstrate land side, electrically coupled to the electrically conductivefirst plug, and disposed directly below the electrically conductivefirst plug; and a microelectronic die disposed above the laminatedmounting substrate, wherein the microelectronic die is coupled to thelaminated mounting substrate through an electrical contact that contactsthe surface finish film.
 2. The apparatus of claim 1, further includinga board electrically coupled to the laminated mounting substrate at theland side.
 3. The apparatus of claim 1, wherein the surface finish filmcomprises a plurality of the layers.
 4. The apparatus of claim 1,wherein the surface finish film is planar to the laminated mountingsubstrate die side.
 5. The apparatus of claim 1, wherein the laminatedmounting substrate comprises a plurality of dielectric layers.
 6. Theapparatus of claim 1, further including an electrically conductivesecond plug disposed between the electrically conductive first plug andthe electrically conductive subsequent plug.
 7. The apparatus of claim1, wherein the electrical contact comprises a solder interconnect. 8.The apparatus of claim 1, wherein the surface finish film includes asurface finish first film in physical contact with the electricallyconductive first plug, and a surface finish second film disposed uponthe surface finish first film, and wherein the surface finish first filmis electrochemically more noble than the surface finish second film. 9.The apparatus of claim 1, wherein standoff between the laminatedmounting substrate die side and the microelectronic die is 60 μm,wherein the electrical contact that contacts the surface finish layerhas a diameter of 74 μm, and wherein pitch between the electricalcontact in the recess and an adjacent electrical contact in an adjacentrecess is 150 μm.
 10. The apparatus of claim 1, wherein standoff betweenthe laminated mounting substrate die side and the microelectronic die is60 μm, wherein the electrical contact that contacts the surface finishlayer has a diameter of 74 μm, and wherein pitch between the electricalcontact in the recess and an adjacent electrical contact in an adjacentrecess is 150 μm, the apparatus further including: a board electricallycoupled to the laminated mounting substrate at the land side, andwherein the board is electrically coupled through an electrical contactthat has a diameter of 200 μm and a pitch of 400 μm.
 11. An apparatuscomprising: a laminated mounting substrate including a die side and aland side; a plurality of surface finish films, wherein each of theplurality of surface finish films is disposed in a respective recess ofa plurality of recesses on the mounting substrate die side; a pluralityof electrically conductive first plugs in contact with respectivesurface finish films; a plurality of electrically conductive subsequentplugs disposed on the mounting substrate land side, each electricallycoupled to respective electrically conductive first plugs of theplurality of electrically conductive first plugs, wherein each of theplurality of electrically conductive plugs is disposed directly belowits respective electrically conductive first plug; and a microelectronicdie disposed above the laminated mounting substrate, wherein themicroelectronic die is coupled to the laminated mounting substratethrough a plurality of electrical contacts that contacts respectivesurface finish films, wherein the plurality of electrical contactsincludes at least one perimeter contact next to an edge of the laminatedmounting substrate and at least one center contact, and wherein the atleast one perimeter contact is larger than the at least one centercontact.
 12. The apparatus of claim 11, further including a boardelectrically coupled to the laminated mounting substrate at the landside.
 13. The apparatus of claim 11, wherein the surface finish filmcomprises a plurality of the layers.
 14. The apparatus of claim 11,wherein the surface finish film is planar to the laminated mountingsubstrate die side.
 15. The apparatus of claim 11, wherein the laminatedmounting substrate comprises a plurality of dielectric layers.
 16. Theapparatus of claim 11, further including an electrically conductivesecond plug disposed between the electrically conductive first plug andthe electrically conductive subsequent plug.
 17. The apparatus of claim11, wherein the electrical contact comprises a solder interconnect. 18.The apparatus of claim 11, wherein the surface finish film includes asurface finish first film in physical contact with the electricallyconductive first plug, and a surface finish second film disposed uponthe surface finish first film, and wherein the surface finish first filmis electrochemically more noble than the surface finish second film. 19.A computing system comprising: a laminated mounting substrate includinga die side and a land side; a surface finish film disposed in a recesson the mounting substrate die side; an electrically conductive firstplug in contact with the surface finish film; an electrically conductivesubsequent plug disposed on the mounting substrate land side,electrically coupled to the electrically conductive first plug, anddisposed directly below the electrically conductive first plug; amicroelectronic die disposed above the laminated mounting substrate,wherein the microelectronic die is coupled to the laminated mountingsubstrate through an electrical contact that contacts the surface finishfilm; a board electrically coupled to the laminated mounting substrateat the land side; and an external memory coupled to the microelectronicdie.
 20. The computing system of claim 19, wherein the computing systemis part of one of a cellular telephone, a pager, a portable computer, adesktop computer, and a two-way radio.